CLP Scholarship in Mechanical Engineering
On the Donor
In 2002, CLP Power Hong Kong Limited (CLP) offered an annual donation to establish a Scholarship at the University in recognition of the academic excellence of students in the Electrical Engineering programme.
In September 2015, CLP extended the scheme to include students in the Mechanical Engineering programme.
In March 2017, the Scholarship was further expanded to support second and third year students in both Electrical Engineering and Mechanical Engineering curricula.
In July 2025, CLP increased the award amount to HK$20,000 each.
Purpose and Scope
One undergraduate scholarship shall be available for award annually to an academically outstanding student who is pursuing studies in the second or third year of full-time study in the Bachelor of Engineering in Mechanical Engineering programme.
Selection criteria:
- academic merit (GPA of 3.0 or above),
- good command of language and communication skills,
- effective team players,
- have broad interests in social and extra-curricular activities,
- posses leadership potential, and
- hold a valid permit to work in Hong Kong SAR to be
eligible for the CLP internship after awarded.
The successful candidates shall be offered to join the CLP Internship Programme (CIP) either as Summer Intern or Sandwich Intern for at least 8 weeks within the current calendar year and complete the CIP before entering their final year of undergraduate study, subject to CLP’s discretion and mutual agreement.
| Value of Award | HK$20,000 each |
| Renewal Conditions | -- |
| Type of Scholarships | Merit-based Scholarships for Current Students |
| Place of Origin of Students | Not specified |
| Level of Study | Undergraduate |
| Faculty | Engineering |
